Force deflection and resistance testing system and method of use

ABSTRACT

A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 16/181,846, filed on Nov. 6, 2018, which is a continuation ofU.S. patent application Ser. No. 15/462,383 which was filed on Mar. 17,2017, which is a continuation-in-part of U.S. patent application Ser.No. 14/996,045 which was filed on Jan. 14, 2016, which claims priorityto U.S. Provisional Patent Application No. 62/104,117 which was filed onJan. 16, 2015, which is hereby incorporated by reference herein in itsentirety, including any figures, tables, or drawings.

FIELD OF THE DISCLOSURE

This disclosure relates to a testing system. More specifically andwithout limitation, this disclosure relates to a testing system forelectrical interconnects, and related method of use.

BACKGROUND OF THE DISCLOSURE

Along with the development of semiconductor chips, a need developed totest these semiconductor chips to ensure that they are manufacturedwithin specified tolerances and function properly. Many manufacturers ofsemiconductor chips such as Intel®, AMD®, Xilinx®, Texas Instruments®,NVIDIA®, Qualcomm® among countless others manufacture semiconductorchips which are then tested by a chip testing system having a deviceunder test printed circuit board (DUT PCB) with an electricalinterconnect that is attached thereto. The DUT PCB and electricalinterconnects are generally custom made to fit each specificsemiconductor chip, making them quite expensive.

Manufacturers tend to simultaneously manufacture a variety ofsemiconductor chips within their facilities to maximize their overheadand equipment utilization rates. Due to these multiple product lines,manufacturers have a need to test a variety of semiconductor chips atthe same time, each type of chip requiring a special electrical testinterconnect. Since cleanroom space is extremely limited it isundesirable to have a dedicated testing machine for each type ofelectrical interconnect. Conventional testing systems are not capable oftesting a plurality of electrical interconnects, nor are conventionaltesting systems easily converted between configurations for testingdifferent electrical interconnects.

Therefore, manufacturers of semiconductor chips have a need for atesting electrical interconnects that is capable of testing a variety ofelectrical interconnects, and one that quickly and easily convertsbetween testing various electrical interconnects, which are problems notsolved by the prior art. Manufacturers of semiconductor chips furtherhave a need for this testing system to be as small as possible tomaximize valuable cleanroom space.

Thus, it is a primary object of the disclosure to provide a quick changesmall footprint testing system and method of use that improves upon thestate of the art.

Another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that quickly converts betweenconfigurations for testing different electrical interconnects.

Yet another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that easily converts betweenconfigurations for testing different electrical interconnects.

Another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that is easy to use.

Yet another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that provides accuratetesting for electrical interconnects.

Another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that can be used with a widevariety of electrical interconnects.

Yet another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that is relativelyinexpensive.

Another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that has a long useful life.

Yet another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that has a small footprint.

Another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that minimizes the amount ofspace required to test a variety of electrical interconnects.

Yet another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that minimizes the capitalcost for testing equipment for testing a variety of electricalinterconnects.

Another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that provides for quickremoval of and replacement of DUT PCBs having electrical interconnectsthereon.

Yet another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that is high quality.

Another object of the disclosure is to provide a quick change smallfootprint testing system and method of use that is durable.

Yet another object of the disclosure is to provide an improved method oftesting the performance of an electrical interconnect.

Another object of the disclosure is to provide an improved system fortesting the performance of an electrical interconnect.

Yet another object of the disclosure is to provide a method of testingthe performance of an electrical interconnect that closely correlateswith how the electrical interconnect will perform in actual-use.

These and other objects, features, or advantages of the presentdisclosure will become apparent from the specification and claims.

SUMMARY OF THE DISCLOSURE

A testing system is presented having a bottom plate, a frame member anda socket plate. The socket plate holds and the frame member houses aplurality of electrical testing components therein. A removable deviceunder test (DUT) printed circuit board (PCB) is placed on top of thesocket plate and electrically connects with the electrical testingcomponents. A removable top plate is placed on top of the DUT PCB and islocked in place by a plurality of locking posts connected to anactuating mechanism. The locking posts connect to cam surfaces in thetop plate that selectively hold the top plate in place therebysandwiching the DUT PCB between the top plate and the socket plate. TheDUT PCB is quickly and easily removed and replaced by activating theactuating mechanism and removing the top plate. In this way, a singletesting system can be used to test a great variety of semiconductorchips thereby reducing capital equipment costs and space needed incleanrooms. A actuator is also presented that presses the device undertest into the electrical interconnect at increments where tests areperformed on one, some or all of the contact points of the electricalinterconnect. This information is then analyzed and graphed to assistwith determine the optimum force and/or height to use during actual use.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of a testing system, the viewshowing the frame member, with the pedestal support, sprite stiffener,DUT PCB, top plate, electrical interconnect and DUT separated from theframe member;

FIG. 2 is a perspective view of the testing system of FIG. 1, the viewshowing the frame member, DUT PCB, top plate, electrical interconnectand DUT assembled onto the frame member;

FIG. 3 is a side elevation view of the assembled testing system of FIG.2;

FIG. 4 is an end elevation view of the assembled testing system of FIG.2;

FIG. 5 is a top elevation view of the assembled testing system of FIG.2;

FIG. 6 is a bottom elevation view of the assembled testing system ofFIG. 2;

FIG. 7 is a cut-away elevation view through an end of the assembledtesting system of FIG. 2, the view cut through the rotation of axis ofthe locking posts, the view showing the electrical testing boardsconnected by edge connectors into the sockets, the sockets connected tothe tester PCB, the tester PCB connected to the socket plates and thebottom side of the capsules, the capsules electrically connect to theDUT PCB, and the floating plate pressing down on the DUT PCB and the topplate pressing down on the floating plate by compressed compressiblemembers; the view also showing the protrusions of the locking posts heldwithin the cam members of the top plate;

FIG. 8 is a perspective view of the cut away view of FIG. 7, the figurealso showing the testing aperture in the top plate and the electricalinterconnect connected to the upper surface of the DUT PCB and a DUTpositioned within the electrical interconnect;

FIG. 9 is a second perspective view of the cut away view of FIG. 7, thefigure also showing the testing aperture in the top plate and theelectrical interconnect connected to the upper surface of the DUT PCBand a DUT positioned within the electrical interconnect;

FIG. 10 is a cut-away elevation view through a side of the assembledtesting system of FIG. 2, the view cut through the rotation of axis ofthe locking posts, the view showing the electrical testing boardsconnected by edge connectors into the sockets, the sockets connected tothe tester PCB, the tester PCB connected to the socket plates and thebottom side of the capsules, the capsules electrically connect to theDUT PCB, and the floating plate pressing down on the DUT PCB and the topplate pressing down on the floating plate by compressed compressiblemembers; the view also showing the protrusions of the locking posts heldwithin the cam members of the top plate;

FIG. 11 is a perspective view of the cut away view of FIG. 10, thefigure also showing the testing aperture in the top plate and theelectrical interconnect connected to the upper surface of the DUT PCBand a DUT positioned within the electrical interconnect;

FIG. 12 is a second perspective view of the cut away view of FIG. 10,the figure also showing the testing aperture in the top plate and theelectrical interconnect connected to the upper surface of the DUT PCBand a DUT positioned within the electrical interconnect;

FIG. 13 is a side elevation cut-away view of a cam member, the viewshowing the cam surface next to the key slot opening, the cylindricalopening, the flat upper surface and the stop surface;

FIG. 14 is a perspective view of the cut away view of FIG. 13;

FIG. 15 is a perspective view of the upper surface of the top plateshowing a close up view of a cam member with a locking post insertedtherein and in an engaged position wherein the protrusions are inengagement with the stop surfaces and sitting on the flat uppersurfaces; the view showing the key slot openings and the cylindricalopening, the view also showing the cam surfaces;

FIG. 16 is an exploded perspective view of the system, the view showingthe top plate, the DUT PCB exploded off of the frame member; the viewalso showing one side of the system having the socket plate with socketopenings exploded off of the tester PCB with a capsule in ademonstrative position below a socket opening; the view showingelectrical testing cards connected by edge connectors to socketsconnected to the lower surface of tester PCB; the view also showing theopening for air flow into the end wall;

FIG. 17 is a close up perspective view showing a capsule withcompressible electrical contacts extending upward from the capsule'supper surface, the capsule connected to the upper surface of a testerPCB; the view also a plurality of sockets connected to the lower surfaceof the tester PCB, the sockets holding an electrical testing board byway of an edge connector therein;

FIG. 18 is a close-up side elevation view of two sockets, a portion ofthe tester PCB and a capsule; the view showing various components inhidden lines including a fastener and the compressible electricalcomponents including the springs therein;

FIG. 19 is a bottom perspective view of a top plate, the view showingthe floating plates connected to the bottom surface of the top plate bya plurality of compressible members;

FIG. 20 is a side perspective view of the top plate of FIG. 19;

FIG. 21 is a perspective view of an adjustment mechanism;

FIG. 22 is a bottom perspective view of the DUT PCB, the view showingthe contact fields 50 in rows on opposing sides of the DUT PCB, the viewalso showing the center area of the DUT PCB;

FIG. 23 is a top perspective view of a capsule, the view showing aplurality of compressible contacts aligned in two sets of rows, each sethaving four rows of contacts therein the rows separated by an isle downthe middle that provides room for fasteners, the view showing thecapsules formed of two opposing halves connected together along aseamline;

FIG. 24 is a bottom perspective view of a capsule, the view showing aplurality of compressible contacts (or contact pads or sockets) alignedin two sets of rows, each set having four rows of contacts therein therows separated by an isle down the middle that provides room forfasteners, the view showing the capsules formed of two opposing halvesconnected together along a seamline;

FIG. 25 is a front elevation view of the electrical interconnect testingdevice shown in FIGS. 1-24, the view showing the addition of a gantryhaving a actuator that is positioned above the electrical interconnecttesting device, the gantry configured to move forward to back, theactuator configured to move side to side, the actuator configured topress the device under test into the electrical interconnect atincrements for testing the actual in-situ performance of the contactpoints of the electrical interconnect;

FIG. 26 is a side elevation view of the electrical interconnect testingdevice with a gantry and actuator shown in FIG. 25, the view showing theaddition of a gantry having a actuator that is positioned above theelectrical interconnect testing device, the gantry configured to moveforward to back, the actuator configured to move side to side, theactuator configured to press the device under test into the electricalinterconnect at increments for testing the actual in-situ performance ofthe contact points of the electrical interconnect;

FIG. 27 is a top elevation view of the electrical interconnect testingdevice with a gantry and actuator shown in FIGS. 25 and 26, the viewshowing the addition of a gantry having a actuator that is positionedabove the electrical interconnect testing device, the gantry configuredto move forward to back, the actuator configured to move side to side,the actuator configured to press the device under test into theelectrical interconnect at increments for testing the actual in-situperformance of the contact points of the electrical interconnect;

FIG. 28 is a close-up perspective view of the electrical interconnecttesting device with a gantry and actuator shown in FIGS. 25-27, the viewshowing the pusher of the actuator pressing a device under test into theelectrical interconnect which is attached to the device under testprinted circuit board which is electrically connected to the electricaltesting boards of the electrical interconnect testing device;

FIG. 29 is a close-up perspective view of the electrical interconnecttesting device with a gantry and actuator shown in FIGS. 25-28, the viewsimilar to that shown in FIG. 28, the view showing the pusher of theactuator about to press a device under test into the electricalinterconnect which is attached to the device under test printed circuitboard which is electrically connected to the electrical testing boardsof the electrical interconnect testing device;

FIG. 30 is an exemplary chart of data from an example test using thesystem presented in FIGS. 25-29, the chart showing “Filtered CumulativeFDR per contactor for N FDR(s);

FIG. 31 is an exemplary graph of data from an example test using thesystem presented in FIGS. 25-29, the graph showing “Test Force kg v.Test Z mm Error Bars,” “Test Force kg v. Test Z mm,” “Mean v. Test Z mmError Bars,” and “Mean v. Test Z mm”;

FIG. 32 is an exemplary chart of data from an example test using thesystem presented in FIGS. 25-29, the chart showing “Raw CumulativeScatter FDR chart per contactor for N FDR datasets”;

FIG. 33 is a graph of data from an example test using the systempresented in FIGS. 25-29, the graph showing Test Force kg. v. Test Countand Mean vs Test Count;

FIG. 34 is an exemplary chart of data from an example test using thesystem presented in FIGS. 25-29, the chart showing “STD-DEV of CRES v.displacement/Pin x versus contactor array for N FDR (s) mean”;

FIG. 35 is an exemplary graph of data from an example test using thesystem presented in FIGS. 25-29, the graph showing “Stdev. v. Test Zmm”;

FIG. 36 is a second exemplary chart of data from an example test usingthe system presented in FIGS. 25-29, the chart showing “FilteredCumulative SFDR per contactor for N FDR(s)”;

FIG. 37 is a second exemplary graph of data from an example test usingthe system presented in FIGS. 25-29, the graph showing “Test Force kg v.Test Z mm Error Bars,” “Test Force kg v. Test Z mm,” “Mean v. Test Z mmError Bars,” and “Mean v. Test Z mm”;

FIG. 38 is a second exemplary chart of data from an example test usingthe system presented in FIGS. 25-29, the chart showing “STD-DEV of CRESvs. displacement/Pin x versus contactor array for N. FDR(s) mean”;

FIG. 39 is a second exemplary graph of data from an example test usingthe system presented in FIGS. 25-29, the graph showing “Stdev v. Test Zmm”;

FIG. 40 is a second exemplary chart of data from an example test usingthe system presented in FIGS. 25-29, the chart showing “Raw CumulativeScatter FDR chart per contactor for N FDR datasets;

FIG. 41 is a second exemplary graph of data from an example test usingthe system presented in FIGS. 25-29, the graph showing “Mean v. TestCount”;

FIG. 42 is a perspective view of an example electrical interconnect foruse with the electrical interconnect testing device;

FIG. 43 is a perspective view of the bottom surface of a device undertest used with the electrical interconnect testing device (which may bea solid reference standard, or it may be a more-sophisticated referencechip that is formed using printed circuit board or semi-conductormanufacturing processes);

FIG. 44 is a close-up perspective view of the bottom surface of a deviceunder test used with the electrical interconnect testing device (whichmay be a solid reference standard, or it may be a more-sophisticatedreference chip that is formed using printed circuit board orsemi-conductor manufacturing processes) shown in FIG. 43, the viewshowing the contact points of the device under test in detail;

FIG. 45A is a side elevation view of an exemplary contact point for usewith a electrical interconnect, the contact point being formed of anupper plunger, a lower plunger and a spring mechanism, the view showingthe stroke of the contact point and the threaded section, the view alsoshowing the points that help make electrical contact in the upper andlower ends of the contact point;

FIG. 45B is a side elevation view of an exemplary contact point in afree arrangement, where the contact point is held within the electricalinterconnect but neither the upper end nor the lower end of the contactpoint is in engagement or electrical contact; a set arrangement, wherethe contact point is held within the electrical interconnect and thelower end of the contact point is in engagement and electrical contactwith the contact pad of the device under test printed circuit board; anda contact arrangement, where the contact point is held within theelectrical interconnect and the lower end of the contact point is inengagement and electrical contact with the contact pad of the deviceunder test printed circuit board and the upper end of the contact pointis in engagement and electrical contact with the contact point of thedevice under test;

FIG. 46 is a plan view of the steps of a testing method.

DETAILED DESCRIPTION OF THE DISCLOSURE

In the following detailed description, reference is made to theaccompanying drawings which form a part hereof, and in which is shown byway of illustration specific embodiments in which the disclosure may bepracticed. These embodiments are described in sufficient detail toenable those skilled in the art to practice the disclosure, and it is tobe understood that other embodiments may be utilized and thatmechanical, procedural, and other changes may be made without departingfrom the spirit and scope of the disclosure(s). The following detaileddescription is, therefore, not to be taken in a limiting sense, and thescope of the disclosure(s) is defined only by the appended claims, alongwith the full scope of equivalents to which such claims are entitled.

As used herein, the terminology such as vertical, horizontal, top,bottom, front, back, end, sides and the like are referenced according tothe views, pieces and figures presented. It should be understood,however, that the terms are used only for purposes of description, andare not intended to be used as limitations. Accordingly, orientation ofan object or a combination of objects may change without departing fromthe scope of the disclosure.

With reference to the figures, a testing system 10 is presented. Testingsystem 10 is formed of any suitable size, shape and design. In thearrangement shown, as one example, testing system 10 includes a bottomplate 12, a frame member 14, a socket plate 16, a device under testprinted circuit board (or DUT PCB) 18, a top plate 20, an actuatingmechanism 22, a plurality of locking posts 24, and a plurality ofalignment posts 26 among other components.

Frame member 14 is formed of any suitable size, shape and design. In thearrangement shown, as one example, fame member 14 is generally square orrectangular in shape and forms a hollow interior 27 which houses othercomponents of the system 10, as is further described herein. Framemember 14 is formed of a pair of opposing sidewalls 28 that extend froma lower end 30 to an upper end 32 in approximate parallel spacedrelation to one another. Sidewalls 28 connect at their outward edges 34to end walls 36. A pair of opposing end walls 36, like sidewalls 28,extend from a lower end 38 to an upper end 40 in approximate parallelspaced relation to one another. End walls 36 connect at their outwardedges 42 to the outward edges 34 of sidewalls 28. Sidewalls 28 and endwalls 36 are arranged in approximate perpendicular alignment to oneanother. In this way, the connection of sidewalls 28 to end walls 36forms a generally square or rectangular box or frame that houses thecomponents shown and described herein. However, any other size or shapeof frame member 14 is hereby contemplated for use.

The sidewalls 28 and end walls 36 of frame member 14 connect at theirlower ends 30/38 to bottom plate 12. Bottom plate 12 is formed of anysuitable size, shape and design and is used for supporting and closingthe lower end of testing system 10 for placement on a table, desk orother surface, or alternatively for connecting system 10 to anothermachine, such as a semiconductor testing system, automated testingsystem, a pick and place machine or any other machine or device. Bottomplate 12 is generally planar in shape, and defines a generally planarupper surface 44 and a generally planar lower surface 46.

The sidewalls 28 and end walls 36 of frame member 14 connect at theirupper ends 32/40 to socket plate 16. In the arrangement shown, onesocket plate 16 is positioned on either side of the center of framemember 14. However, any number of socket plates 16 are herebycontemplated for use, such as one, or an arrangement wherein four socketplates 16 are used, one on each side of the center of frame member 14,each socket plate 16 positioned in 90° alignment or square alignment tothe adjacent socket plates 16. Socket plates 16 are formed of anysuitable size, shape and design and are used for connecting to orholding a plurality of electrical testing components 48 therein as isfurther described herein. In the arrangement shown, socket plates 16 aregenerally planar in shape, with a generally planar upper surface 50 anda generally planar lower surface 52. In the arrangement shown, onesocket plate 16 is connected to each side of frame member 14 each ofwhich include a plurality of socket openings 54 therein that are sizedand shaped to receive and electrically connect to electrical testingcomponents 48, as is further described herein.

When installed, the upper end of electrical testing components 48 areheld within the socket openings 54 with the remaining portions ofelectrical testing components 48 hanging vertically downward therefromwithin the hollow interior formed by frame member 14. This arrangementallows for a high density of electrical testing components 48 within asmall footprint.

In one arrangement, electrical testing components 48 include a rigidcapsule 49A which is removably held within or connected to socketopening 54. In one arrangement, rigid capsules 49A include a pluralityof compressible electrical contacts 49B in its upward facing surfacethat extend upward therefrom and/or in its downward facing surface thatextend down ward. Alternatively, the downward facing surface of rigidcapsules 49A include contact fields or sockets that are used to makeelectrical connections (instead of spring loaded or compressibleelectrical contacts 49B). These compressible electrical contacts 49B areelectrically connected to an electrical testing board 49C, also known asa card. In the arrangement shown, electrical testing boards arevertically aligned and extends downward from the rigid capsule 49A. As arigid capsule 49A with compressible electrical contacts 49B is connectedto or placed in each socket opening 54, these electrical testing boards49C or cards are aligned in approximate parallel spaced relation withinthe hollow interior of testing system 10 in close but spaced relation toone another. This allows the maximum density of electrical testingboards 49C to be electrically connected the system 10.

In one arrangement, as is shown, rigid capsules 49A are generallyrectangular in shape and have generally planar upper and lower surfaceswhich oppose one another in approximate parallel spaced relation. Inthis arrangement, rigid capsules 49A are formed of a pair of opposinghalves 49D that connect together in generally flush engagement with oneanother and are held together, in one arrangement, by fastener 49E,however any other manner of connection is hereby contemplated for use.In one arrangement, these compressible electrical contacts 49B are knownin the industry as pogo pins. A Pogo pin is a device used in electronicsto establish a (usually temporary) connection between two printedcircuit boards. Named by analogy with the pogo stick toy, the pogo pinusually takes the form of a slender cylinder containing two sharp,spring-loaded pins. Pressed between two electronic circuits, the sharppoints at each end of the pogo pin make secure contacts with the twocircuits and thereby connect them together.

In one arrangement, compressible electrical contacts 49B also extend outof the lower surface of the rigid capsule 49A as well as the uppersurface, whereas in other arrangements, the lower surface of rigidcapsule 49A includes sockets or electrical contact pads as is furtherdescribed herein.

In the arrangement shown, wherein rigid capsules 49A are generallyrectangular in shape, the socket openings 54 in socket plate 16similarly generally rectangular in shape and are sized and shaped toreceive rigid capsules 49A therein with close tolerances. In thisarrangement, the plurality of socket openings 54 and therefore theplurality of rigid capsules 49A are aligned in approximate parallelspaced relation in rows across the socket plate 16. As one socket plate16 is positioned on each side of the system 10, this arrangement forms apair of rows of socket openings 54 and capsules 49A, one on each side ofthe system 10.

The upper surface of capsules 49A is configured to electrically connectto the lower surface of DUT PCB 18, and the lower surface of capsules 49is configured to electrically connect to the upper surface of testerprinted circuit board 49F (tester PCB). In one arrangement, capsules 49Aare connected to the upper surface of tester PCB 49F by fasteners 49Ewhich extend through and connect both capsules 49A and tester PCB 49F,in spaced alignment to one another such that the capsules 49A fit withinthe plurality of socket openings 56 in socket plate 16.

A plurality of sockets 49G are connected to the lower surface of testerPCB 49F. Sockets 49G are formed of any suitable size, shape and designand serve to removably receive electrical testing boards 49C andelectrically connect the electrical testing boards 49C to the tester PCB49F, the capsules 49A and therefore the rest of the electricalcomponents of the system 10. In the arrangement shown, sockets 49Ginclude an edge connector. That is, sockets 49G receives the upper edgeof an electrical testing board 49C therein that holds the electricaltesting board 49C therein and serves to electrically connect theelectrical testing board 49C. In the arrangement shown, two sockets 49Gare used to connect to a single capsule 49A. In one arrangement, as isshown, each capsule 49A includes eight rows of compressible electricalcontacts 49B, which are separated into two groups, one group for eachelectrical testing board 49B. Also, as shown, seven capsules 49A areconnected to each socket plate 16 and tester PCB 49F and thereforefourteen electrical testing boards 49C are used on each side of system10. However, any other number of sockets, capsules and electricaltesting boards are hereby contemplated for use.

When assembled, the electrical contacts in the upper edges of electricaltesting boards 49C are electrically in contact with the sockets 49G. Thesockets 49G electrically connect to the tester PCB 49F. The tester PCB49F electrically connects to the capsules 49A, which are held within thesocket openings 54 of socket plate 16. When the DUT PCB 18 is placed ontop of the socket plate 16, the compressible electrical contacts 49B inthe capsules 49A electrically contact the contact fields 58 in the lowersurface of DUT PCB 18, as is further described herein.

Device under test (DUT) Printed circuit board 18 (DUT PCB 18) sits ontop of socket plate 16. DUT PCB 18 is formed of any suitable size shapeand design. In the arrangement shown, DUT PCB 18 is generally square orrectangular in shape with its periphery being smaller or slightlysmaller than the periphery of frame member 14 such that DUT PCB 18 fitswithin the exterior edge of frame member 14 when placed on top of framemember 14.

In one arrangement, as is shown, a plurality of alignment posts 26extend upward a distance from the upper end 32/40 of frame member 14 inapproximate parallel alignment with the height of testing system 10.Alignment posts 26 are formed of any suitable size, shape and design. Inthe arrangement shown, alignment posts 26 are generally cylindricalrods. Alignment posts 26 align with alignment openings 56 in DUT PCB 18when DUT PCB 18 is properly aligned with frame member 14 and placed ontop of frame member 14. DUT PCB 18 includes a plurality of electricalcontact fields 58 or electrical pads positioned in the lower surface ofDUT PCB 18. In this way, when DUT PCB is placed on top of frame member14 over alignment posts 24, the electrical contact fields 58 of DUT PCB18 are accurately aligned with spring loaded or compressible electricalcontacts 49A of the capsules 49A of electrical testing components 48. Inthis way, spring loaded or compressible electrical contacts 49A ofelectrical testing components 48 electrically connect with contactfields 58 of DUT PCB 18. In one arrangement, the alignment posts 26 areconfigured such that the DUT PCB 18 and/or the top plate 20 can only bepositioned on top of the system 10 in one manner of alignment, therebypreventing improper assembly of the system 10.

In the arrangement, wherein two rows of electrical testing boards 49C,sockets 49G and capsules 49A are part of the system 10, with one row oneach side of the system 10, the contact fields 58 of DUT PCB 18 aresimilarly aligned in two rows, one row on either side of the center ofthe DUT PCB 18. This arrangement leaves the center area 60 of DUT PCB 18open for connection of electrical interconnect 94 and reception of thedevice under test 96 (DUT), as is further described herein.

Top plate 20 removably sits on top of DUT PCB 18, socket plate 16 andframe member 14. Top plate 20 is formed of any suitable size shape anddesign and is used for tightly and accurately holding DUT PCB 18 intocontact with socket plate 16 and frame member 14 while also beingquickly and easily removed from DUT PCB 18, socket plate 16 and framemember 14 so as to allow for quick and easy replacement of DUT PCB 18 toaccommodate other DUTs 96. In the arrangement shown, top plate 20includes a plurality of cam members 62 placed therein. Cam members 62may be separate components connected to or installed into top plate 20,or cam members 62 may be formed directly into top plate 20 by machiningor other the like processes.

More specifically, top plate 20 is generally planar in shape with agenerally flat lower surface 64 and a generally flat top surface 66. Inthe arrangement shown, a cam member 62 is positioned approximately ineach corner of top plate 20 so as to provide even and smooth downwardforce across top plate 20. Cam members 62, when viewed from above orbelow, have a generally cylindrical body 68 and include a generallycylindrical opening 70 positioned approximately at its middle thatextends vertically through the cam member 62. At least one key slotopening 72 is connected to cylindrical opening 70. Key slot opening 72is formed of any suitable size shape and design. In the arrangementshown, when viewed from above or below, key slot opening 72 is generallyrectangular in shape and extends outward from or through the center ofcylindrical opening 70.

Key slot opening 72 is positioned adjacent to a lower edge of camsurface 74. Cam surface 74 extends from key slot opening 72 and aroundcylindrical opening 70 as it extends at an angle toward upper surface 64from lower surface 66. In one arrangement, the upper end of cam surface74 terminates in a generally flat upper surface 74A or plateau which ispositioned next to a stop surface 74B that defines the upper end of camsurface 74. That is, in the arrangement shown, each key slot opening 72connects to the lower end of the sloped cam surface 74, with each keyslot opening 72 being positioned on opposite sides of the cam member 62.

Cylindrical openings 70 and key slot openings 72 are sized and shaped toreceive the upper ends of locking posts 24. That is, the upper end oflocking posts 24 include keys or protrusions 76 that extend outwardtherefrom. In the arrangement shown, keys or protrusions 76 arecylindrical posts that extend outward in a generally perpendicularalignment to the length or height of locking posts 24 adjacent the upperend of locking posts 24. These posts are generally cylindrical in shape;however any other shape is hereby contemplated. In the arrangementshown, when viewed from the side, locking posts 24 with protrusions 76have a T-shape. However, any other shape is hereby contemplated for use.

Top plate 20 also includes a plurality of alignment openings 78 therein.These alignment openings 78 are sized and shaped to receive the upperend of alignment posts 26 therein in the same or similar manner thatalignment openings 56 in DUT PCB 18 receive alignment posts 26.

When top plate 20 is placed on top of testing system 10, the alignmentopenings 78 of top plate are aligned with the alignment posts 26 offrame member 14 and the top plate 20 is lowered thereon. In thisposition, the cylindrical openings 70 and key slot openings 72 of cammembers 62 are aligned with the upper ends of locking posts 24 when thelocking posts 24 are in a disengaged position. As the top plate 20 islowered, the upper ends of locking posts 26 pass through the cylindricalopenings 70 in the cam members 62 and the keys or protrusions 76 passthrough the key slot openings 72 in the cam members 62 until the topplate 20 is fully lowered in place with the lower surface of the topplate 20 in contact with the upper surface of DUT PCB 18. Once in thisposition, the locking posts 24 are rotated, this causes the keys orprotrusions 76 to rotate out of the key slot openings 72 and to engageand slide upward along the cam surfaces 74. As the keys or protrusions76 slide upward along cam surfaces 74, because the locking posts 24 arevertically fixed relative to the frame member 14, this pulls the topplate 20 into tighter and tighter engagement with the frame member 12 asthe keys or protrusions 76 slide upward upon cam surfaces 74. This pullsthe DUT PCB 18 into tighter and tighter engagement with the frame member14, socket plate 16, and the compressible electrical contacts 49A ofcapsule s held within the socket openings 54. This continues until theprotrusions 76 reach the flat upper surface 74A connected to the camsurface 74, and/or the protrusions 76 reach and engage the stop surface74B. At this point the protrusions 76 can rest on the flat upper surface74A. In one arrangement, so ensure that the protrusions do notunintentionally slide off of the flat upper surface 74A, a detentfeature 74C is positioned at or near the upper end of the cam surface 74or at or near the beginning of the flat upper surface 74A. This detentfeature 74 requires the application of additional force to dislodge theprotrusion from the flat upper surface 74A and thereby preventsunintentional disengagement thereof.

In one arrangement, the lower surface 64 of top plate 20 includes one ormore compressible members 80 that extend downward therefrom.Compressible members 80 are formed of any compressible or resilientdevice such as a spring, a compressible piece of material, an air bag,an air chamber, a piston or the like. In the arrangement shown,compressible members 80 are springs and connect to floating plate 82that directly engage the top surface of DUT PCB 18. The use of floatingplate 82 and compressible members 80 ensure even pressure and constantand repeatable tightening force. In the arrangement shown, one floatingplate 82 is positioned on either side of the center of system 10 and issized and shaped to cover approximately the area where contact fields 58of DUT PCB 18, capsules 49A, Electrical testing boards 49C, tester PCBs49F, sockets 49G, and capsules 49A are located. The size, shape andlocation of floating plates 82 ensure that appropriate, even andconstant downward pressure is generated between the compressibleelectrical contacts 49B of capsules 49A and the contact fields 58 of DUTPCB 18 thereby ensuring proper, constant and repeatable electricalconnection there between.

In addition, to ensure repeatable tightening, and to preventovertightening, a plurality of stop bars 84 extend upward from testingsystem 10, or in an alternative arrangement downward from top plate 20.Stop bars 84 are formed of any suitable size shape and design and definea stopping surface for top plate 20. In the arrangement shown, stop bars84 are generally cylindrical in shape and terminate in a generally flatend which flatly engages top plate 20 thereby stopping the lowerprogression of top plate 20 relative to frame member 14.

Top plate 20 also includes a testing aperture 86 that is generallycentrally located therein, or located at its approximate middle. In thearrangement shown, the rows of electrical testing boards 49C andcapsules 49A are positioned on either side of the testing aperture 86.Testing aperture 86 is formed of any suitable size shape and design. Inthe arrangement shown, testing aperture 86 is generally square orrectangular in shape and separates top plate 20 into opposing sides 88.Testing aperture 86 provides access through top plate 20 and to theupper surface of center area 60 of DUT PCB 18 for testing purposes.

In one arrangement, a guide 89 (not shown) is connected to top plate 20and positioned around testing aperture 86. Guide 89 is formed of anysuitable size, shape and design. In one arrangement, guide 89 serves thepurpose of conforming the testing aperture 86 to meet the size and shapeof a handler device or other device that loads DUT 96 into testingsystem 10. In one arrangement, guide 89 also provides additionalstructural rigidity to the system 10. In one arrangement, guide 89provides additional mounting capabilities for top plate 20.

DUT PCB 18 is formed of any suitable size shape and design. In thearrangement shown, DUT PCB 18 is generally square or rectangular inshape with its periphery being smaller or slightly smaller than theperiphery of frame member 14 such that DUT PCB 18 fits within theexterior edge of frame member 14 when placed on top of frame member 14.DUT PCB 18 has a generally flat upper surface 90 that extends inapproximate parallel spaced relation to a generally flat lower surface92. DUT PCB 18 includes a plurality of contact fields 58 positioned inits lower surface 92 that electrically connect with compressibleelectrical contacts 49B of rigid capsules 49A held within socketopenings 54. These contact fields 58 are aligned on both sides of centerarea 60 of DUT PCB 18.

An electrical interconnect 94 is connected to the upper surface 90 ofDUT PCB 18 and is sized and shaped to receive a device under test (DUT)96, such as a semiconductor chip, a reference chip, a shorting device, areference standard or the like. Electrical interconnect 94 is formed ofany suitable size, shape and design and is generally sized and shapedspecifically to receive DUT 96 within close and tight tolerances and inmating engagement with one another. In the arrangement shown, electricalinterconnect 94 includes a raised peripheral edge 98 which surrounds andprovides a border to a field of contact points 100 positionedapproximately at the center of the electrical interconnect 94.

In one arrangement, as is shown, electrical interconnect 94 is what isknown as a test socket. However, the disclosure herein is not limited totesting test sockets only. Instead, the disclosure is applicable totesting any device or system that forms an electrical interconnect.

Electrical interconnect 94 is affixed to the upper surface 90 of DUT PCB18 such that when DUT PCB 18 is placed on top of testing system 10, andtop plate 20 is placed on top of DUT PCB 18, electrical interconnect 94is positioned within testing aperture 86 and is accessible from abovetesting system 10. Or, said another way, testing aperture 86 providesaccess to electrical interconnect 94 which is positioned within thecenter area 60 of DUT PCB 18.

Electrical interconnect 94 includes a plurality electrical contacts 100positioned at its center within a raised peripheral edge 98 ofelectrical interconnect 94 which surrounds the electrical contacts 100.The electrical contact points 100 of electrical interconnect 94electrically connect to electrical traces or leads that extend throughDUT PCB 18 and electrically connect to the electrical contact fields 58positioned in the lower surface 92 of DUT PCB 18. In this way, the DUTPCB serves to electrically connect the electrical interconnect 94, andany DUT 96 positioned within the electrical interconnect 94, connectedto the top surface of the DUT PCB 18 to the electrical testingcomponents 48 (capsules 49A, compressible electrical contacts 49B,electrical testing boards 49C, Tester PCBs 49 f) positioned below theDUT PCB 18. As such, when DUT PCB 18 is placed on top of testing system10, the electrical contact points 100 of electrical interconnect 94electrically contact through DUT PCB 18 to the electrical testingcomponents 48.

In a manufacturing environment, DUT 96 is often a sophisticatedsemiconductor chip that provides sophisticated functionality andcapabilities in a tremendously compact size. However, in a testingenvironment, wherein electrical interconnect 94 is being tested, DUT 96is often a shorting device or a reference standard. Often, when DUT 96is a shorting device it is a solid metallic or plated metallic devicethat has a generally well known resistance which is suitable for testingpurposes. Often, DUT 96 is reference standard that mimics a certaincondition or provides an anticipated result that is useful for testingpurposes.

DUT 96 often has a very high density of electrical contacts in its lowersurface that electrically connect the DUT 96 to the device DUT 96 isinstalled in (such a computer's motherboard, or the like). Accordingly,to test all of the contacts DUT 96 has in its lower surface, electricalinterconnect 94 has a corresponding number of electrical contacts orpoints 100 in its upper surface. Testing system 10 is configured toperform complex and sophisticated testing procedures on DUT 96 whichrequire sophisticated and complex electrical testing components 48 (asare described herein). DUT PCB 18 serves to connect the dense electricalcontacts in the bottom surface of DUT 96 (the electrical contact points100 in the upper surface of electrical interconnect 94) to theelectrical testing components 48 of the system 10 through a network ofelectrical traces embedded within the DUT PCB 18. As such, through itsnetwork of internal electrical leads (or traces) DUT PCB 18 expands thedense electrical leads in the bottom surface of DUT 96 outward and tothe sides of DUT PCB 18 so as to provide room for the electrical testingcomponents 48 needed to perform the electrical tests to ensure DUT 96 isa conforming device and within spec. As such, through its network orelectrical traces, DUT PCB 18 serves to expanded surface area of theelectrical contacts 100 in electrical interconnect 94 outward so as toprovide room for the needed electrical testing components 48 of system10. While system 10 houses the electrical testing components 48 in avery dense arrangement, the surface area required for the electricaltesting components 48 is substantially greater than the surface area ofthe electrical contacts in the DUT 96.

Locking posts 24 are formed of any suitable size, shape and design. Inthe arrangement shown, locking posts 24 extend vertically through framemember 14 with the lower ends protruding outward from the bottom plate12 and the upper ends protruding outward from the socket plate 16. Inthe arrangement shown, a locking post 24 is positioned approximately ineach corner of the testing system 10 so as to provide even tightening oftop plate 20. The lower ends of locking posts 24 connect to a rotatablemember 110 having a pair of posts 112 extending downward therefrom, eachpost 112 being off center from the axis of rotation 114 of locking post24.

Each post 112 is connected to a linkage 116. Linkages 116 mechanicallylink the rotatable member 110 to the adjacent rotatable members 110 andthereby mechanically connect all locking posts 24 to one another. Inthis way, when one rotatable member 110/locking post 24 moves, so movesall other rotatable members 110/locking posts 24. Linkages 116 areformed of any suitable size, shape and design. In the arrangement shown,linkages 116 are generally elongated bars that terminate in threadedheads 118 having openings with bearing surfaces that connect to posts112. In this way linkages 116 are lengthwise adjustable, using thethreaded ends, and allow for rotation of posts within heads 118.

At least one rotatable member 110 includes an arm 120 that extendsoutward therefrom and connects to actuating mechanism 22. Actuatingmechanism 22 is formed of any device that actuates or causes rotation oflocking posts 24. In the arrangement shown, actuating mechanism 22 is anelectrical, pneumatic or hydraulic device, such as a solenoid, a piston,a cylinder, or the like that moves arm 120 between an engaged position,which locks top plate 20 in place, and a disengaged position, whichallows top plate to be removed and replaced. In the arrangement shown,actuating mechanism 22 is connected to the exterior lower edge of framemember 14. In an alternative arrangement, actuating mechanism 22 is amanual device, such as a bar or lever that extends outward from theexterior lower edge of frame member 14. Arm 120 connects to actuatingmechanism at an axis of rotation 122 that allows rotation of arm 120relative to actuating mechanism 22 as actuating mechanism 22 moves.

To provide proper clearance for movement of locking posts 24, rotatablemembers 110, posts 112, linkages 116, threaded heads 118 and arm 120,these components reside within recesses 122 grooves, or deviations inthe bottom plane or bottom surface or bottom plate 120 of system 10 thatprovide clearance for these components and allow for their unencumberedmovement.

Due to the high density of the electrical testing components 48positioned within the hollow interior of frame member 14, the testingsystem 10 generates a great amount of heat. To combat this heatgeneration, fan members 126 are connected to the end walls 36 and/orsidewalls 28 which pull or push air movement through the hollow interiorof frame member 14 thereby cooling the electrical testing components 48and preventing the system from overheating. Fan members 126 are formedof any suitable air moving device and fluidly connect to openings 127 orpassageways in the end walls 36 and/or sidewalls 28 of frame member 14that maximize the amount of air that can flow through end walls 36and/or sidewalls 28.

In arrangements where a handler, machine, robot, or other device isplacing DUT 96 into electrical interconnect 94, it may be necessary toprovide additional structural rigidity to DUT PCB 18 so as to preventflexing or breakage of DUT PCB 18. In some arrangements, the addition ofa sprite stiffener 130 is beneficial. In these arrangements, spritestiffener 130 is any device which is attached to the lower surface 92 ofDUT PCB 18 below the electrical interconnect 94. Sprite stiffener 130 isformed of any rigid component and is connected to DUT PCB 18 in anymanner known in the art such as passing threaded fasteners through DUTPCB 18 and sprite stiffener 130, using adhesives, or the like. In thearrangement shown, sprite stiffener 130 is generally square orrectangular in shape and fits within the testing aperture 86 of topplate 20.

To provide further structural rigidity, a pedestal support 132 can beplaced within the hollow interior 27 of frame member 14 and below theelectrical interconnect 94. Pedestal support 132 is any device whichprovides structural support to the lower side of DUT PCB 18. In onearrangement, as is shown, pedestal support 132 is an adjustable devicewhich resides within the hollow interior 27 of frame member 14 and sitsupon the upper surface of the bottom plate 12 and includes a pad 134that engages the lower surface 92 of DUT PCB 18. In the arrangementshown, pedestal support 132 has, at its bottom end, a generally flatbottom surface 136 that flatly connects to the upper surface of bottomplate 12. Similarly, in the arrangement shown, at its upper end pedestalsupport 132 has a pad 134 that has a generally flat upper surface thatflatly connects to the lower surface 92 of DUT PCB 18, sprite stiffener130 or any other component that provides support to the bottom side ofDUT PCB 18. An adjustment mechanism 138 is positioned between the bottomsurface 136 and pad 134 that adjusts the height of pad 134 so as toprovide optimal support to DUT PCB 18 and prevent flexing caused by theinsertion of DUT 96 by a robot or machine. Adjust mechanism 138 is anydevice or arrangement that allows for vertical adjustment such as athreaded collar over a threaded shaft, a gearing arrangement or thelike.

In Operation:

To assemble the testing system 10, a DUT PCB 18 is selected for theparticular DUT 96 that is being manufactured and therefore needs to betested. Once selected, the DUT PCB 18 is placed on top of the testingsystem 10 and on top of socket plates 16. When placing the DUT PCB 18 ontop of the socket plate 16, care is taken to ensure that the alignmentposts 26 of testing system 10 align with and are received within thealignment openings 56 of DUT PCB 18. Once aligned in this manner, DUTPCB 18 is lowered until the lower surface 92 of DUT PCB 18 engages theupper surface 50 of socket plate 16. In this position, the contactfields 58 of DUT PCB 18 physically engage the compressible electricalcontacts 49B of the capsules 49A held within the socket openings 54 ofsocket plates 16. In this way, the DUT PCB 18 is electrically connectedto the electrical testing boards 49C of electrical testing components48.

Once in this position, top plate 20 is placed on top of DUT PCB 18. Thisis accomplished by aligning the alignment openings 78 in top plate 20with the upper end of alignment posts 26. Once in this position, topplate 20 is lowered onto testing system 10 until the lower surface offloating plate 82 engages the upper surface 90 of DUT PCB 18 or untilthe top plate 20 engages the upper end of the stop bars 84.

As the top plate 20 is aligned with the alignment posts 26, the lockingposts 24 are simultaneously aligned with the cam members 62. Morespecifically when the locking posts 24 are in a disengaged position, thelocking posts 24 are aligned with the cylindrical openings 70 in the cammembers 62 and the keys or protrusions 76 attached to the locking posts24 are aligned with the key slot openings 72 in the cam members 62.

Once in this position, the top plate is lowered in place. Once fullylowered, the actuating mechanism 22 is actuated, either by manualmovement or by motorized movement. As the actuating mechanism 22 ismoved, the rotatable member 110 that arm 120 directly connects torotates thereby causing all other rotatable members 110 to similarlyrotate. This rotation of rotatable member 110 simultaneously and evenlycauses the rotation of the other rotatable members 110 by transferringthis rotational movement through the arrangement of posts 112, throughlinkages 116 and into the other rotatable members 110.

As the rotatable members 110 rotate, so rotates the locking posts 24. Asthe locking posts 24 rotate out of their disengaged position, the keysor protrusions 76 rotate out of the key slot openings 72. As the keys orprotrusions 76 rotate out of the key slot openings 72 the keys orprotrusions 67 engage the angled or sloping cam surface 74 of cammembers 62. As the locking posts 24 continue to rotate this causes thekeys or protrusions 76 to slide over the cam surfaces 74 which has theeffect of pulling the top plate 20 closer to and into tighter engagementwith testing system 10. This progression continues until the lockingposts 24 are fully rotated and the keys or protrusions 76 reach aplateau or level portion 74A at the end of the cam surface 74, and/orthe keys or protrusions 76 engage the stop surface 74B at the end of thecam surface 74, at which point the top plate 20 is fully engaged andtightened against testing system 10 and the testing system 10 is readyfor testing. As the top plate 20 is pulled lower the compressiblemembers 80 vertically compress thereby applying pressure to force theDUT PCB 18 towards the frame member 14.

Once the system 10 is assembled, with the DUT PCB 18 and top plate 20installed, to use the testing system 10, a DUT 96 is then placed in theelectrical interconnect 94 such that the edges of the DUT 96 are alignedwith the raised peripheral edge 98 of the electrical interconnect 94 andthe contact points 100 in the upper surface of the electricalinterconnect 94 receive, engage and electrically connect to theelectrical contacts of the DUT 96. Once in this position, electricalsignals are transmitted through the electrical testing components 48 andthrough the DUT 96.

More specifically, the electrical testing boards 49C send and receiveelectrical signals through the edge connectors of sockets 49G. Thesesignals then transmit through the electrical leads of tester PCB 49F andinto the capsules 49A. More specifically, the electrical signals passthrough the compressible electrical contacts 49B of capsules 49A andinto the contact fields 58 of DUT PCB 18. These electrical signalstravel through the DUT PCB 18 and into the electrical interconnect 94.These electrical signals then pass through the electrical interconnect94 and into the DUT 96. These electrical signals travel through the DUT96 and back to the electrical testing boards 49C through the same or asimilar path; and the process repeats. The electric testing components48 measure these signals and determine whether the DUT 96 is conformingor non-conforming.

Once the test is complete, the DUT 96 is removed and another DUT 96 isinserted into the electrical interconnect 94 and the process isrepeated.

This process is repeated until another type or style of DUT 96 needs tobe tested at which point the DUT PCB 18 is removed using the oppositeprocess described above. That is, the actuating mechanism 22 is rotatedin an opposite direction until the keys or protrusions 76 are in adisengaged position from the cam members 62. Once disengaged, the topplate 20 is removed and the DUT PCB 18 is removed. Next, a new DUT PCB18 that includes a electrical interconnect 94 configured specificallyfor the new DUT 96 to be tested is selected and the above-describedprocess is repeated for installing the new DUT PCB 18 and testing thenew DUT 96.

Rectangular and Square Arrangements:

It is to be noted, that while a single rectangular testing device 10 ispresented in the drawings having one or more rows of electrical testingboards 49C aligned on two, opposing, sides of the testing system 10, itis hereby contemplated that a square or cross shaped testing system maybe utilized having four rows of electrical testing boards 49C, one rowon each of the squared sides of testing aperture 86/center area 60 ofDUT PCB 18. This arrangement allows for the use of additional electricaltesting boards 49C. Also, another

Double Wide:

It is also to be noted, that the teachings herein apply to a widerversion of the device shown in the drawings. That is, the depth of thedevice can be increased any amount to accommodate any number ofelectrical testing boards 49C and/or multiple electrical interconnects94 and/or any sized or shaped DUT 96.

System Force, Deflection & Resistance:

With reference to FIGS. 25-29 a cycler system 200 is shown in use withelectrical interconnect testing device 10, which is described herein.Cycler system 200 is formed of any suitable size, shape and design andis configured to provide repeatable and reproducible measurement ofelectrical interconnect 94. In the arrangement shown, as one example,cycler system 200 includes a gantry 202 that extends over electricalinterconnect testing device 10 that supports a actuator 204.

Gantry 202 is formed of any suitable size, shape and design and isconfigured to support actuator 204 above the electrical interconnect 94and device under test 96 of electrical interconnect testing device 10while facilitating movement of the actuator in the X-direction (e.g.left-to-right) and Y-direction (e.g. forward-to-back). In onearrangement, as is shown, gantry 202 includes a bottom plate 206 that isgenerally square or rectangular in shape, when viewed from the above,and is generally planar in shape when viewed from the front or side. Inthe arrangement shown, electrical interconnect testing device 10 ispositioned on top of the upper surface of bottom plate 206, and in onearrangement is attached thereto by any manner, method or means such asscrewing, bolting, locking or the like. The outward edges of bottomplate 206 includes rails 208 that facilitate movement of the actuator204 in the Y-direction (e.g. forward-to-back). In the arrangement shown,rails 208 extend all or a portion of the forward-to-back length ofbottom plate 206.

Gantry 202 includes a tower 210 that has opposing legs 212 that connectto an upper portion 214. Legs 212 connect at their lower end to rails208 at a carrier 216. Carrier 216 is any device that connects to rails208 and facilitates movement thereon. In the arrangement shown, thefeatures of carrier 216 mate with the features of rails 208 such thatcarriers 216 slide upon rails 208. Also, in the arrangement shown,carrier 216 include a break mechanism 218. Break mechanism 218 is anydevice which when released allows for movement of carriers 216 on andover rails 208 and when engaged prevents movement of the tower 210 withrespect to bottom plate 206. In the arrangement shown, break mechanism218 is a locking screw activated by a rotatable knob, however any otherarrangement is hereby contemplated for use such as a push button, afriction member, a cam member, a spring-loaded pin, or any othermechanism.

In the arrangement shown, the connection of opposing legs 212 to upperportion 214 form a hollow interior space 220 between opposing legs 212and between the upper surface of bottom plate 206 and the lower edge ofupper portion 214. Electrical interconnect testing device 10 ispositioned within this hollow interior space 220. In the arrangementshown, when viewed from the front or back, legs 212 extend inwardslightly as they extend upward such that the upper portion 214 isslightly narrower than the width of rails 208 in bottom plate 206. Whenviewed from the side, the sides of tower 210, (legs 212 and upperportion 214), are generally flat and planar and extend in approximateparallel spaced relation to one another. In the arrangement shown, legs212 and upper portion 214 are formed of a single plate on the forwardand back sides of tower 210 that are connected to side plate 222positioned there between, which are connected together by a plurality offasteners 224.

Upper portion 214 of tower 210 of gantry 202 includes an opening 226that extends vertically through the upper portion 214 of tower 210 andfacilitates connection to actuator 204. In the arrangement shown, as oneexample, opening 226 is generally square or rectangular in shape whenviewed from above and includes rails 228 therein that extend inapproximate perpendicular alignment to the rails 208 of bottom plate206. Rails 228 extend in approximate parallel spaced relation to oneanother. In this arrangement, actuator 204 is connected to rails 228 bycarriers 230. Carrier 230 is any device that connects to rails 228 andfacilitates movement thereon. In the arrangement shown, the features ofcarrier 230 mate with the features of rails 228 such that carriers 230slide upon rails 228. Also, in the arrangement shown, carriers 230include a break mechanism 232. Break mechanism 232 is any device whichwhen released allows for movement of carriers 230 on and over rails 228and when engaged prevents movement of the actuator 204 with respect tobottom plate 206 and tower 210. In the arrangement shown, breakmechanism 232 is a locking screw activated by a rotatable lever, howeverany other arrangement is hereby contemplated for use such as a pushbutton, a friction member, a cam member, a spring-loaded pin, or anyother mechanism. The connection of actuator 204 to rails 228 facilitatesmovement of the actuator 204 in the X-direction (e.g. left-to-right). Inone arrangement, while movement in the Z-direction is automated byactuator 204, movement in the X-direction and Y-direction are performedmanually. In another arrangement, movement in the X-direction and/or theY direction are automated as is movement in the Z-direction by actuator204.

Actuator 204 is formed of any suitable size, shape and design andfacilitates vertical movement so as to press device under test 96 intoelectrical interconnect 94. In the arrangement shown, actuator 204includes a post 234 that includes a pusher 236 connected to its lowerend. Actuator 204 operates to vertically move post 234 and pusher 236into device under test 96 and electrical interconnect 94, so as to testthe electrical interconnect 94 at different vertical distances andforces as is further described herein. Actuator 204 may be anelectrically controlled device, such as a solenoid or the like, apneumatically controlled device, a hydraulically controlled device, orany other device which facilitates vertical movement.

With reference to FIG. 42, a close up perspective view of an example ofan electrical interconnect 94 is shown. Electrical interconnect 94 issized and shaped to receive a device under test (DUT) 96 therein, suchas a semiconductor chip, a reference chip, or the like. In thearrangement shown, electrical interconnect 94 includes a raisedperipheral edge 98 which surrounds and provides a border to a field ofcontact points 100 positioned approximately at the center of theelectrical interconnect 94. In the arrangement shown, electricalinterconnect 94 includes a plurality of openings 238 that are used tofacilitate connection to DUT PCB 18, or a production tester device, byway of receiving conventional screws or bolts there through. Electricalinterconnects 94 are custom designed to test the specific device undertest 96.

Electrical interconnect 94 includes a plurality electrical contacts 100positioned at its center within the raised peripheral edge 98 ofelectrical interconnect 94 which surrounds the field of electricalcontacts 100. The electrical contact points 100 of electricalinterconnect 94 electrically connect to electrical traces or leads thatextend through DUT PCB 18 and electrically connect to the electricalcontact fields 58 positioned in the lower surface 92 of DUT PCB 18. Inthis way, the DUT PCB serves to electrically connect the electricalinterconnect 94, and any DUT 96 positioned within the electricalinterconnect 94, to the top surface of the DUT PCB 18 to the electricaltesting components 48 (capsules 49A, compressible electrical contacts49B, electrical testing boards 49C, Tester PCBs 49 f) positioned belowthe DUT PCB 18.

In one arrangement, as is shown, contact points 100 are known in theindustry as pogo pins. A pogo pin is a device used in electronics toestablish a (usually temporary) connection between two printed circuitboards. Named by analogy with the pogo stick toy, the pogo pin usuallytakes the form of a slender cylinder containing two sharp, spring-loadedpins. Pressed between two electronic circuits, the sharp points at eachend of the pogo pin make secure contacts with the two circuits andthereby connect them together.

With reference to FIG. 45A, an exemplary pogo pin is shown as an exampleof a contact point 100. As is shown, contact point 100 (pogo pin)includes an upper plunger 240, a lower plunger 242 and a spring member244 positioned there between, among other components that facilitateelectrical connection there between. In the arrangement shown, upperplunger 240 is generally cylindrical in shape and includes one or aplurality of pointed features in its upper end that help facilitateforming an electrical connection to a contact point 246 of device undertest 96. Contact point 100 (pogo pin) also includes a lower plunger 242that is generally cylindrical in shape and includes one or a pluralityof pointed features in its lower end that help facilitate forming anelectrical connection to a contact pad 240 in the upper surface 90 ofdevice under test printed circuit board 18. A spring member 244 connectsthe inward facing sides of upper plunger 240 and lower plunger 242 andfacilities the compression of the upper plunger 240 and lower plunger242 as well as facilitates electrical connection between the upperplunger 240 and the lower plunger 242 throughout the range ofcompression between a fully extended position and a fully compressedposition. In the arrangement shown, the upper plunger 240 has a hollowsection in its lower end that is sized and shaped to receive the upperend of lower plunger 242 therein; however, the opposite arrangement ishereby contemplated for use.

This arrangement allows the upper plunger 240 and lower plunger 242 tocompress upon one another until the upper edge of lower plunger 242engages the upper edge of the hollow interior of upper plunger 240 atwhich point the contact point 100 is fully compressed and pressing itfurther may cause structural damage to the contact point 100. In analternative arrangement, neither the upper plunger 240 and lower plunger242 include a hollow interior and instead the inner end of the upperplunger 240 and lower plunger 242 abut one another when fullycompressed.

The amount of distance a contact point 100 is capable of compressing isknown as the stroke 248. The amount of stroke 248 as well as the amountof force required to compress contact point 100 to the optimum level isoften a manufacturer specified value. As is also shown, the exteriorsurface of the lower portion of upper plunger 240 includes a threadedsection 250, this threaded section 250 represents a fixed andnon-compressible portion of the contact point 100.

With Reference to FIG. 45B, an exemplary contact point 100 is shown invarious stages of use. At 252 contact point 100 is shown in what isknown as a free arrangement, at 254 contact point 100 is shown in whatis known as a set arrangement, and at 256 contact point 100 is shown inwhat is known as a contact position.

In a free arrangement, at 252, contact point 100 is installed within anopening in the electrical interconnect 94 as one of many contact points100 and the upper end of the upper plunger 240 is not in electricalcontact and the lower end of the lower point 242 is not in electricalcontact. In this arrangement, contact point 100 is in a fully extendedposition or uncompressed position while being constrained within theelectrical interconnect 94.

In a set arrangement, at 254, the lower end of lower plunger 242 isengaged with electrical contact pad 258 of the printed circuit board 18and the upper end of the upper plunger 240 is not in electrical contact.In this arrangement, the contact point 100 of the electricalinterconnect 94 is in electrical contact with the contact pad 258 of theprinted circuit board 18. In this arrangement, due to the engagementbetween the lower end of the lower plunger 242 and the contact pad 258of the printed circuit board 18 the contact point 100 is in a partiallycompressed state.

In a contact arrangement, at 256, the lower end of lower plunger 242 isengaged with electrical contact pad 258 of the printed circuit board 18and. In this arrangement, the contact point 100 of the electricalinterconnect 94 is in electrical contact with the contact pad 258 of theprinted circuit board 18 and the contact point 246 of device under test96. In this arrangement, due to the engagement between the lower end ofthe lower plunger 242 and the contact pad 258 of the printed circuitboard 18, and the engagement between the upper end of the upper plunger240 and the contact point 246 of the device under test 96, the contactpoint 100 is in a compressed state. In the contact arrangement, at 256,the contact point 100 is supposed to be compressed to its optimumdistance as well as force so that it forms the optimum electricalconnection between the contact point 246 of the device under test 96 andthe contact pad 258 of the printed circuit board 18.

Generally, manufacturers of contact points 100 provide as standardspecifications the optimum and maximum stroke 248 of a particularcontact point 100 as well as the amount of force required to compressthe contact point 100 to the optimum and maximum level. Generally, theusers of these contact points 100 (manufacturers of semiconductor chips)simply accept this information and adopt it into their manufacturingprocesses without testing and verifying its accuracy. This is largelybecause there are no available testing devices or known methods foraccurate testing. As such, the users of these contact points 100 blindlydrive their testing equipment to these standard specifications (such asoptimum height and/or optimum force) without knowing whether thisprovides optimum results.

Manufacturers of contact points 100 characterize and specify theircontact points 100 in an isolated mechanical and electrical setup toremove any external factors from the collected data. While this iseffective at characterizing a single contact point, this may not lead toan accurate characterization of a plurality of contact points 100 withina electrical interconnect 94. This can lead to miss-correlation ofperformance when placed in a system application where other mechanicaland electrical factors may impact performance or lifespan of one or morecontact points 100.

In the arrangement presented, the electrical interconnect testing device10 with the cycler 200 closely mimics the application environment andall external factors that may be encountered in the production useenvironment which leads to accurately understanding the performancecharacteristics of not just one contact point 100 in isolation, butinstead to understanding the performance characteristics of all thecontact points 100 held within a specific electrical interconnect 94.With this information, the user can drive the contact points 100 not toa manufacturer specification that was determined in isolation butinstead to the optimum amount of compression and/or force for optimumperformance of that particular electrical interconnect 94. That is, thelowest amount of resistance across all contact points 100 while ensuringelectrical connection to all contact points 100 while also ensuring thatthe contact points 100 are not compressed further than they need to bewhich can lead to premature failure.

In addition, the electrical interconnect testing device 100 with thecycler 200 allows a user to characterize both electrical and mechanicalperformance along with lifespan of the electrical contacts 100 in afast, easy and automated manner. That is, the electrical interconnecttesting device 100 with the cycler 200 can be used to repeatedly test anelectrical interconnect 94 to determine the dynamic changes of theelectrical interconnect 94 as the number of cycles increase. Thistesting can be accomplished in temperature and other environmentalconditions similar to those present in the production environment whichcan lead to further accuracy.

Furthermore, the sample size capabilities of the electrical interconnecttesting device 10 with the cycler 200 provides for exceptional levels ofaccuracy and detail. Traditionally, users only sample a small number ofelectrical contacts 100, such as one to up to thirty. This is due to thelimited electrical test capabilities of existing testing systems. In onearrangement, the electrical interconnect testing device 10 presentedherein has 5320 kelvin test channels, meaning that every contact point100 can be tested, not just one or a handful of contact points 100. Evenmore test channels are contemplated for use with minor modifications tothe system which can allow for the number of test channels to bedoubled, tripled, quadrupled or more. This leads to statisticallysignificant improvement in the sample population and thereforestatistically significant improvement in the results. Furthermore, itwould take a significant amount of time to collect this amount of datausing existing systems (on the order of a few weeks to a few years).

Furthermore, the accuracy of the actuator 204, which is capable ofdriving downward at 1-micron increments, or sub-micron increments,facilitates exceptionally high levels of accuracy and the collection ofmassive amounts of data. Traditionally, users only sample at themanufacturer-specified resistance or vertical height, or in exceptionalcases in a small number of heights or force levels. This is due to thelimited electrical test capabilities of existing testing systems and thelack of integration with these limited systems with a actuator 204. Inone arrangement, the electrical interconnect testing device 10 presentedherein is capable of testing up to 5320 kelvin test channels (or more)at every micron or sub-micron increments, and this process can berepeated (or cycled) multiple times meaning that every contact point 100can be tested at every micron or every sub-micron level or incrementthroughout its stroke, not just at one or a handful of points a fewtimes. This leads to statistically significant improvement in the samplepopulation and therefore statistically significant improvement in theresults. Furthermore, it would take a significant amount of time tocollect this amount of data using existing systems (on the order of afew weeks to a few years).

The massive amount of data that is collected using the electricalinterconnect testing device 10 with the cycler 200 is transported to agraphing function where the characteristics of the overall electricalinterconnect 94 can be graphed revealing what is actually occurring tothe electrical interconnect 96 itself throughout the stroke 248.

In addition, recipes can be created using the electrical interconnecttesting device 10 with the cycler 200 where the increments of theactuator 204 can be set and the contact points 100 can be established.The increments can be set based on distance, as an example, the actuator204 drives down in one-micron increments and takes a measurement.Alternatively, the increments can be set based on force, as an example,the actuator 204 drives down until a predetermined amount of resistanceis met. At each increment, the recipe can call for testing any onecontact point 100, all of the contact points 100, a random grouping ofthe contact points 100 or a predetermined group of the contact points100. In addition, the recipe can be set to cycle the test any number oftimes, from once to many hundreds or thousands of times.

The electrical interconnect testing device 10 with the cycler 200provides data with exceptionally high levels of statistical accuracywith an exceptional amount of time. The speed of the testing reduces thecost of the testing as compared to prior systems and methods. Thedetailed information reveals the actual characteristics of theelectrical interconnect 94 throughout its operating range.

Method of Testing:

As one example, electrical interconnect testing device 10 is attached tobottom plate 206 of cycler system 200 under gantry 202. In this positionthe gantry 202 passes over electrical interconnect testing device 10 asit slides on rails 208. In this position, the actuator 204 moves overelectrical interconnect testing device 10 in the X-direction as itslides on rails 228.

The proper DUT PCB 18 is placed on the electrical interconnect testingdevice 10 and the desired electrical interconnect 94 is attached to theupper surface 90 of DUT PCB 18. Care is taken when attaching theelectrical interconnect 94 to the DUT PCB 18 such that the lowerplungers 242 of the plurality of contact points 100 that extend out ofthe bottom surface of the electrical interconnect 94 align with, engageand electrically connect to the plurality of electrical contact pads 258in the upper surface 90 of the DUT PCB 18. Once in this position, theelectrical interconnect 94 is tightened in place using fasteners thatextend through openings 238 in electrical interconnect 94 and into theDUT PCB 18. As the electrical interconnect 94 is tightened against theDUT PCB 18 the contact points 100 of the electrical interconnect 94partially compress, or more specifically the lower plunger 242 movescloser to upper plunger 240 as the spring mechanism 244 partiallycompresses. In this position, the contact points 100 of electricalinterconnect 94 are electrically connected to the electrical testingboards 49C through traces that extend through DUT PCB 18 and throughelectrical contact pads 258.

The top plate 20 is tightened against the DUT PCB 18 using cam members62.

Next, a device under test 96 is placed in the electrical interconnect94. As the device under test 96 is placed within the electricalinterconnect 94, the raised peripheral edges 98 help guide the deviceunder test 96 into alignment such that the electrical contact points 246in the bottom surface of the device under test 96 align with theelectrical contacts 100 extending upward from the center of theelectrical interconnect 94.

Once in place, theoretically the upper end of upper plungers 240 engagethe contact points 100 of device under test 96. However, in practice,due to countless variables, such as dimensional variation,contamination, oxidation, etc., the device under test 96 must be pressedinto the electrical interconnect 94 a distance or with an amount offorce. As the device under test 96 is pressed into the electricalinterconnect 94 the lower ends of contact points 246 engage the upperend of upper plungers 240. As force is applied to the device under test96 and contact points 246 of the device under test 96 are forced intothe sharp points at the upper end of the contact points 100 ofelectrical interconnect 94 which helps to form an electricallyconductive connection between the contact point 100 of the electricalinterconnect 94 and the contact point 246 of the device under test 96.In this position, the contact points 246 of the device under test 96 andthe contact points 100 of electrical interconnect 94 are electricallyconnected to the electrical testing boards 49C through traces thatextend through DUT PCB 18 and through electrical contact pads 258.

As force is applied to the device under test 96 the contact points 100of the electrical interconnect 94 partially compress, or morespecifically the upper plunger 240 moves closer to the lower plunger 242as the spring mechanism 244 partially compresses. In this position, thecontact points 100 of electrical interconnect 94 are electricallyconnected to the electrical testing boards 49C through traces thatextend through DUT PCB 18 and through electrical contact pads 258.

If the device under test 96 is not moved down far enough, or if enoughforce is not applied to the device under test 96 then the potentialexists that not all of the contact points 100 of the electricalinterconnect 94 will engage the contact points 246 of the device undertest 96, this is due to varying heights of contact points 100 ofelectrical interconnect 94 and/or varying heights of contact points 246of device under test 100. Or, even if the contact points 100 of theelectrical interconnect 94 engage the contact points 246 of the deviceunder test 96, there may be contamination, oxidation or other reasonswhy an electrically conductive connection is not formed there between.It is for these reasons why a certain amount of additional force isapplied, and the device under test 100 is moved downward into theelectrical interconnect 94, to ensure that all of the electricalcontacts 100 of electrical interconnect 94 engage and form anelectrically conductive connection with the electrical contacts 246 ofdevice under test 96.

As the device under test 100 is moved downward, the electrical contactpoints 100 of the electrical interconnect 94 compress thereby taking updimensional variance between the electrical interconnect 94 and thedevice under test 96. However, if the device under test 96 is driven toofar into the electrical interconnect 94 the contact points 100 of theelectrical interconnect will bottom out, meaning that the inner edge ofthe upper plunger 240 will engage the inner edge of the lower plunger242 at which point additional force could damage or destroy theelectrical contact 100 and/or the entire electrical interconnect 94.

The purpose of testing a electrical interconnect 94 is to determinewhether the electrical interconnect 94 is adequately performing. If theelectrical interconnect 94 is not adequately performing, meaning thatthe electrical contacts 100 are imparting excess resistance to the testsof the device under test 96 then when used in production semi-conductorchips (device under test 96) are likely to be unnecessarily rejected orscrapped. As such, this can be a very costly error.

However, prior to the electrical interconnect testing device 10 withcycler 200 there was no adequate or comprehensive way to test theelectrical interconnect 94 to determine whether it was functioningproperly, not to mention functioning optimally. Instead users ofelectrical interconnects 94 merely accepted the manufacturersspecifications as to how much force to apply and/or how far to drive thedevice under test 96 into the electrical interconnect 94. Instead ofaccepting this information as a so-called “known” the electricalinterconnect testing device 10 with cycler 200 can be used to test thefunctioning of the electrical interconnect 94 throughout its operationalrange, and on one, some or all electrical contact points 100 at aplurality of increments.

Test Example

Using the electrical interconnect testing device 10 with cycler system200, at step 300, the device under test 96 is placed into the electricalinterconnect 94.

At step 302, the Y-position, or forward-to-back position of actuator 204is manually adjusted, or adjusted by motorized, pneumatic, hydraulic orelectrical movement in the Y-direction such that the pusher 236 and post234 are directly above the device under test 96. This may beaccomplished manually by disengaging break mechanism 218 and slidinggantry 202 on rails 208 until the proper position is achieved at whichpoint the break mechanism 218 is again engaged thereby locking theY-position of the gantry 202 and actuator 204 in place.

At step 304, the X-position, or left to right position of actuator 204is manually adjusted, or adjusted by motorized, pneumatic, hydraulic orelectrical movement in the X-direction such that the pusher 236 and post234 are directly above the device under test 96. This may beaccomplished manually by disengaging break mechanism 232 and slidingactuator 204 on rails 228 until the proper position is achieved at whichpoint the break mechanism 232 is again engaged thereby locking theX-position of the actuator 204 in place.

At step 306, using software 260 (not shown in detail) configured tocontrol operation of the electrical interconnect testing device 10 andcycler system 200 a testing recipe 262 (not shown in detail) is createdby the user.

At sub step 308, the user enters into the testing recipe 262 some or allof the manufacturer specified information, specifications and/or valuesof the contact points 100 of the electrical interconnect 94 such as, forexample, distance of stroke 248, maximum force 264, and optimum force266, the amount of current they are rated to handle, the amount ofresistance they are intended to have, among any other manufacturerprovided or specified value.

At sub step 310, the user enters into the testing recipe 262 informationregarding the electrical interconnect 94, such as its configuration, thenumber of contact points 100, its physical size, its position, itsdimensions, its shape, its features, and any other information.

At step 312, using software 260 the user enters information as to howthe testing is to be performed. This is accomplished by setting how orwhen or where the testing will begin, how or when or where the testingwill stop, and the increments where the testing will occur between thestart position and the stop position.

At sub step 314A, the starting point is entered or calculated. Thestarting point can be determined by any manner, method or means.

In one arrangement, the testing recipe 262 is configured to drive thepusher 236 downward until a particular force is encountered, which maybe when the pusher 236/actuator 204 first senses engagement with thedevice under test 96 or when the pusher 236/actuator 204 first senses apredetermined amount of force with the device under test 96. (Note: theterm force is used to describe resistance pressure of push-back impartedon the actuator 204 by the electrical interconnect 94/device under test96). The testing recipe 262 may be configured to begin testing at theposition where this force is first encountered, or the testing recipe262 may be configured to back up a certain distance or force beforebeginning testing.

In another arrangement, the testing recipe 262 is configured to drivethe pusher 236 downward until a particular vertical position isencountered, which may be when the pusher 236/actuator 204 first engagesthe device under test 96 or when the pusher 236/actuator 204 achieves acertain position within the stroke 248 of contact points 100.

In yet another arrangement, the actuator 204 or gantry 202 is equippedwith a sensing device that senses a surface of the device under test 96or electrical interconnect 94 or another surface. This may be an opticalsensor, a laser sensor, an infrared sensor, a pressure sensor, or anyother sensor. With this position information, the starting point iscalculated.

At sub step 314B, an ending point is entered or calculated. The endingpoint can be determined by any manner, method or means. In onearrangement, once the starting point is entered, the ending point issimilarly entered. In another arrangement, once the starting point isentered, the ending point is calculated based on the starting point,such as a predetermined distance below the starting point. The endingpoint may be when a particular position is achieved or when a particularforce is encountered.

At sub step 314C, increment information is entered or calculated. Theincrements are where the measurements are taken.

In one arrangement, the number of increments are entered and thesoftware 260 calculates the position of these increments by dividing thedistance between the starting point and the ending point by the numberof increments and the actuator 204 drives to each of these incrementsand the electrical interconnect testing device 10 takes a measurement.In this example, as an example the user enters fifty increments, orone-hundred increments into software 260 and the software 260 dividesthe distance between the starting point and the ending point by thenumber of increments.

In another arrangement, the distance of the increments or between theincrements is entered and the actuator 204 drives downward the specifieddistance and stops at each increment from the starting point to theending point and the electrical interconnect testing device 10 takes ameasurement at each increment. In this example, as an example the userenters one micron or two microns or three microns as the distance of theincrements or between the increments and the actuator 204 drives to eachposition and the electrical interconnect testing device 10 takes ameasurement.

In another arrangement, the force of the increments or between theincrements is entered and the actuator 204 drives downward until thespecified force is achieved and stops at each increment from thestarting point to the ending point and the electrical interconnecttesting device 10 takes a measurement. In this example, as an examplethe user enters 0.1 kg or 0.2 kg or 0.3 kg into software 260 and theactuator 204 drives downward until the desired resistance force isencountered and electrical interconnect testing device 10 takes ameasurement. Once a measurement is taken the actuator 204 again drivesdown until the next incremental force is encountered, and the process isrepeated.

At sub step 314D, the user sets the electrical contacts 100 that are tobe tested. In one arrangement, the user sets software 260 to test allelectrical contacts 100 at all increments. In another arrangement, theuser sets software 260 to test one electrical contact 100 at allincrements, which may or may not be the same electrical contact 100 ateach increment. In another arrangement, the user sets software 260 totest some of the electrical contacts 100 at all increments, which may ormay not be the same electrical contacts 100 at each increment. Inanother arrangement, the user sets software 260 to test a random sampleof the electrical contacts 100 at all increments.

At sub step 314E, the user sets the number of cycles. That is, is thistest to be performed one time, or several times or hundreds of times, orthousands of times. In this example, as an example the user enters 50cycles or 100 cycles into software 260.

At step 316, after the device under test 96 is placed in the electricalinterconnect 94 and the actuator 204 is centered over the device undertest 96, the test itself is performed according to the parameters of thetesting recipe 262.

At step 118, the actuator 204 drives to the starting point. This may beaccomplished by driving directly to the starting point which is a knownposition, a calculated position or a sensed position. Alternatively, theactuator 204 drives downward until a specified resistance force isencountered and either the testing begins at that point which is thestarting point, or the actuator 204 backs up a specified distance oruntil the resistance force diminishes to a predetermined amount, whichthen becomes the starting point.

At step 320, the electrical interconnect testing device 10 performs thetest at the starting point which is essentially the first increment orthe first incremental position. In doing so, the electrical interconnecttesting device 10 tests one, some or all of the contact points 100 thatare specified in the testing recipe 262 to be tested at the firstincrement. In doing so, the electrical testing boards 49C passelectrical signals through the traces in the DUT PCB 18 which passthrough the electrical contact pads 258 of the DUT PCB 18. Theseelectrical signals pass through the contact points 100, or morespecifically the electrical signal passes through the lower plunger 242,(in some arrangements through the spring mechanism 244), through theupper plunger 240 and into the contact point 246 of device under test 96(which in a testing environment is often a solid gold or gold platedreference standard or shorting device that is designed to reduceresistance or provide a predictable amount of resistance for eachcontact point 100). These electrical signals then pass through thedevice under test 96, back through another contact point 100 of theelectrical interconnect 94 in the manner described herein, back throughthe traces in the DUT PCB 18 and into the same or a different electricaltesting board 49C. During this process the resistance is measured forthe electrical contact points 100 that the electrical signal passesthrough. One, some or all of the electrical contact points 100 can betested at the increment. Each contact point 100 can be tested againstany other contact point 100, any group of contact points 100 or allcontact points 100 in the electrical interconnect 94. This informationis saved and/or exported to a controller or computing system that hassoftware 260 used in association with the electrical interconnecttesting device 10 for graphing and analysis purposes.

At step 322, a force measurement is taken by actuator 204, or morespecifically with a sensor or other mechanism associated with actuator204. This information is saved and/or exported to a controller orcomputing system that has software 260 used in association with theelectrical interconnect testing device 10 for graphing and analysispurposes.

At step 324, once the electrical tests have been performed and the forcemeasurement has been taken, the actuator 204 drives to the nextincrement. In one arrangement, the next increment is a predetermineddistance away from the previous increment and the actuator 204 drivesuntil it arrives at this next position. In another arrangement, the nextincrement is an incremental increase in force from the previousincrement and the actuator 204 drives until it arrives at the increased(or decreased) force. Once the actuator 204 drives to the nextincrement, the contact points 100 are tested and the force is sensed.

At step 326 process is repeated in an incremental manner until theactuator 204 drives to the last increment or the ending point is tested.After the ending point is tested, the actuator 204 raises.

At step 328, if the testing recipe 262 includes cycling, the testingprocedure is repeated. This continues until the number of cyclesspecified in the testing recipe 262 is performed.

Result Analysis and Graphing:

The results of the test can be used to analyze the performance of theelectrical interconnect 94 as it actually performs, providingverification/validation of the manufacturer specifications for singleinterconnects.

With reference to FIGS. 30 and 31 the results of a sample test of anexample electrical interconnect 94 is shown.

The “Series #” identifies which parameters are used. With reference tothe chart of FIG. 32, the X-axis is test height or “Test Z mm” which isthe vertical height of the increment or the position of the particulariteration of the test. The vertical or Y-axis to the left is “Test Forcekg” or the amount of force applied and/or sensed by the actuator 204 atthat particular vertical height or increment. The vertical or Y-axis tothe right is the “Mean” resistance, or the resistance sensed orencountered at that particular vertical height or increment. In thisexample, Series #1 uses the left Y-axis, or “Test Force kg” and Series#2 uses the right Y-axis, or “Mean” resistance. The “N” is the number ofcycles, which is the number of times the test is repeated. The moretimes the test is performed the higher the confidence in the results orthe better the statistical significance of the results. More cycles meanmore accurate results. Any number of cycles can be used.

The “Test Count” means the number of increments or the number of pointsthe actuator 204 drives between the starting point and the ending point,inclusive. That is, the actuator 204 drives to this number of positionswhere, at each position or increment, individual tests are performed. Inthis example thirty-one increments are used including the starting pointand the ending point. Any number of increments can be used and theactuator 204 can have one micron or sub one micron resolution.

The “X-Parm” is the parameter of the X-axis for that Series #, which isin this case is the Z-height of the actuator 204 for both Series #1 andSeries #2.

The “Y-Parm” is the parameter of the Y-axis for that Series #. In thisexample, the Y-Parm for Series #1 is the “Test Force kg” which is theleft Y-axis, and the Y-Parm for Series #2 is the “Mean” resistance.

The “Mean” “Min” “Max” and StdDev” represent the mean, minimum, maximumand standard deviation of the force measurement throughout the workingrange (from starting point to the ending point). These measurements arenot applicable to the resistance measurement (Series #2).

The “WOR Mean” “WOR Min” “WOR Max” and “WOR StdDev” represent the mean,minimum, maximum and standard deviation of the resistance measurementthroughout the working range (or WOR)(from starting point to endingpoint). These measurements are not applicable to the force measurement(Series #1).

With reference to the graph at FIG. 31, the dashed line at 350represents the maximum height of the working range, which is a userentered number and/or a specification from the manufacturer of theelectrical interconnect 94 or contact points 100. This represents thehighest point the actuator 204 will be at when the first measurement istaken, also known as the starting point. Similarly, the dashed line at352 represents the minimum height of the working range, which is a userentered number and/or a specification from the manufacturer of theelectrical interconnect 94 or contact points 100. This represents thelowest point the actuator 204 will be at when the last measurement istaken, also known as the ending point.

The line at 354 represents the mean line, or in this case the mean forceline and utilizes the Y-axis at the left side of the chart (Test Forcekg) and correlates to Series #1 (on FIG. 30). This line represents themean force applied by actuator 204 at each increment. The vertical linesthat cross line 354 are error bars at one-sigma from the mean in thisexample, but can represent any deviation amount such as two-sigma, threesigma or any other amount. As is seen in this graph, the force steadilyincreases in a generally straight and linear manner throughout theworking range with the force resistance increasing as the actuator 204continues to drive downward into the electrical interconnect 94. Thisgraph represents an electrical interconnect 94 that performs as would beexpected and as is desired. That is, the harder the contact points 100are pressed, the more the springs therein compress and the more thecontact points 100 push back, again, as is expected. If the contactpoints 100 were to bottom out, meaning that the springs fully compressedand the upper plunger 240 engages the lower plunger 242 this line wouldspike at that point as the resistance would substantially increase. Thisline 354 reveals that the contact points 100 did not bottom out throughthe working range as the line 354 is linear throughout the workingrange.

The line at 356 represents the mean resistance line and utilizes theY-axis at the right side of the chart (Mean, resistance in ohms) andcorrelates to Series #2 (on FIG. 30). This line represents the meanresistance of the contact point(s) 100 tested at each increment. Thevertical lines that cross line 356 are error bars at one-sigma from themean in this example, but can represent any deviation amount such astwo-sigma, three-sigma or any other amount. As is seen in this graph, atfirst, just within the maximum height of the working range 350 theresistance is essentially immeasurable which represents that no contacthas been made between the contact points 246 of device under test 96 andthe contact points 100 of electrical interconnect 94, and/or the pusher236 of actuator 204 has not yet engaged the device under test 96. Atpoint 358, the slope of line 356 dramatically changes which representsthe first increment or the first test where electrical contact ispresent between the contact points 246 of device under test 96 and thecontact points 100 of electrical interconnect 94. From there, as thepusher 236 of actuator 204 continues to push further and furtherdownward (and the force increases) the resistance sensed across thecontact points 100 of electrical interconnect 100 decreases. This graphrepresents a electrical interconnect 94 that performs as would beexpected and as is desired throughout the working range (referencenumerals 350 to 352). That is, the harder the contact points 100 arepressed, the less the resistance, as is expected. This is because asmore force is applied to the device under test 96, the points in theupper end of upper plunger 240 tend to form a better electrical contactwith the contact points 246 of the device under test 96; and as moreforce is applied to the device under test 96, the points in the lowerend of lower plunger 242 tend to form a better electrical contact withthe electrical contact pads 258 of the DUT PCB 18; and as more force isapplied to the device under test 96 the internal electrical contactbetween upper plunger 240, lower plunger 242 and/or spring mechanism 244may also improve. The linearity of this line through the working rangereveals that the electrical interconnect 94 and contact points 100 areworking as expected. Dashed line 360 represents the three-sigma average,dashed line 362 represents the two-sigma average, line 364 representsthe one-sigma average, and dashed line 366 represents the mean, or inthis case the mean average resistance across the working range(reference numerals 350 to 352).

With reference to the graph of FIG. 31, in one arrangement, as oneexample, the test is performed by driving actuator 204 down until theforce entered into software 260 of testing recipe 262 is encountered(which can be the manufacturer specified force or a user selectedforce), which in this example is ˜8.0 kg. At this point the, the minimumheight of the working range 352 is established and the Test Z mm (theX-axis in the graph, but the Z-axis for the actuator 204) is set atzero. In one arrangement, this also represents the ending point, or thelast increment of the testing. From there, the actuator 204 drivesupward the distance entered into software 260 of testing recipe 262(which can be the manufacturer specified distance or stroke 248 ofcontact points 100, or a user selected distance), which in this exampleis ˜0.164 mm. At this point the, the maximum height of the working range350. In one arrangement, this also represents the starting point, or thefirst increment of the testing. In this way, the working range (350 to352) is established without knowing the actual position of the actuator204 or the relative position of the actuator 204, which is essentiallyinconsequential to the test.

With reference to FIGS. 32 and 33, the same data set is presented on adifferent chart. In this example, a scatter chart is presented with theX-axis of the chart representing the Test Count. Presenting thisinformation in this manner reveals additional details about the testresults. (Note some of the WOR calculations are skewed because no WORbars are present on this graph). As is shown at the left portion of thischart reveals that at the initial measurements several tests had highresistance values (referring to the several points to the left ofpractically-vertical portion of line 356 that are substantially abovethe cluster of points). These points indicate that these contact points100 were not in full or complete electrical contact with the deviceunder test 96 at this force/increment. This is understandable as thismay indicate physical variations within the device under test 96 orelectrical interconnect 94, or it may indicate shorter contact points100, or any other variation. As these points, well above the mean revertto the mean as greater force is applied is also expected and indicatesthat these variations/outliers were compensated by pressing the deviceunder test 96 further into electrical interconnect 94.

This chart (FIG. 33) is also representative of the level of detail thatthe system 10 can provide. Namely, the system 10 can indicate preciselyhow many contact points 100 and exactly which points 100 are outliersand therefore just these contact points 100 can be fixed or replaced,(instead of throwing the entire electrical interconnect 94 away orreplacing all the contact points 100—which can lead to greater problemswhen perfectly functioning contact points 100 are replaced).

With reference to FIGS. 34 and 35, the same data set is presented on adifferent chart. In this example, the standard deviation of the contactresistance of contact points 100 is charted verses displacement. Thischart reveals less linearity in the mean resistance line.

With reference to FIGS. 36-41, a second exemplary set of data andaccompanying charts and graphs are presented from an example test usingthe system presented in FIGS. 25-29. More specifically, FIG. 36 is achart of data showing “Filtered Cumulative SFDR per contactor for NFDR(s)”; FIG. 37 is a graph showing “Test Force kg v. Test Z mm ErrorBars,” “Test Force kg v. Test Z mm,” “Mean v. Test Z mm Error Bars,” and“Mean v. Test Z mm”; FIG. 38 is a chart showing “STD-DEV of CRES vs.displacement/Pin x versus contactor array for N. FDR(s) mean”; FIG. 39is a graph showing “Stdev v. Test Z mm”; FIG. 40 is a the chart showing“Raw Cumulative Scatter FDR chart per contactor for N FDR datasets; andFIG. 41 is a graph showing “Mean v. Test Count”.

Any other number of charts and graphs can be generated based on themassive amounts of data generated by electrical interconnect testingdevice 10 that can reveal countless features and properties related tothe performance of electrical interconnect 94. Charts like these can beproduced for every contact point 100 of electrical interconnect 94 (andthere may be thousands or tens of thousands of contact points), for anygroup of contact points 100 or for all contact points 100. Charts likethese can be produced for a wide working range, or down to thesub-micron level were several tests are performed within every micron ofstroke 248. The information provided by electrical interconnect testingdevice 10 is actual performance data of the entire electricalinterconnect 94 in an application practically identical to actual-use.As such, the accuracy of this information is substantially better thanother testing systems and processes and closely reflects how theelectrical interconnect will perform in the manufacturing process.

In addition, this information can be gathered over any number of cycles,from one cycle to several thousand or tens of thousands of cycles.Information gathered by cycle count tests can reveal the durability ofelectrical interconnect 94 and the dynamic changes in the performance ofelectrical interconnect 94 over time. This information can be used toestablish maintenance procedures, contact point replacement proceduresor test and verification procedures.

With the information provided by electrical interconnect testing device10, the proper or optimum vertical height and/or force can be determinedfor each electrical interconnect 94. In addition, the performancecharacteristics of the electrical interconnect 94 can be determinedthroughout the working range of the contact points 100 and on any levelof granularity from an all-point average to each and every point.

From the above discussion, it will be appreciated that a quick changesmall footprint testing system and method of use is presented thatimproves upon the state of the art.

Specifically, the quick change small footprint testing system and methodof use is presented: quickly converts between configurations for testingdifferent semiconductor chips; easily converts between configurationsfor testing different semiconductor chips; is easy to use; providesaccurate testing for semiconductor chips; can be used with a widevariety of semiconductor chips; is inexpensive; long useful life; has asmall footprint; minimizes the amount of space required to test avariety of semiconductor chips; minimizes the capital cost for testingequipment for testing a variety of semiconductor chips; provides forquick removal of and replacement of DUT PCBs having electricalinterconnects thereon; is high quality; and is durable, among countlessother advantages and improvements.

It will be appreciated by those skilled in the art that other variousmodifications could be made to the device without parting from thespirit and scope of this disclosure. All such modifications and changesfall within the scope of the claims and are intended to be coveredthereby.

What is claimed:
 1. A method of testing an electrical interconnect, thesteps comprising: providing an electrical interconnect testing device;providing an electrical interconnect having a plurality of contactpoints; attaching the electrical interconnect to the electricalinterconnect testing device; providing a device under test having aplurality of contact points; aligning the plurality of contact points ofthe device under test with the plurality of contact points of theelectrical interconnect; pressing the device under test into theelectrical interconnect to a plurality of different positions; andtaking at least one measurement of at least one electrical property atthe plurality of different positions.
 2. The method of claim 1, furthercomprising the step of taking a force measurement at the plurality ofdifferent positions.
 3. The method of claim 1, wherein the at least oneelectrical property is resistance; and wherein the measurement of the atleast one electrical property is taken on one of the plurality ofcontact points of the electrical interconnect.
 4. The method of claim 1,wherein the measurement of the at least one electrical property is takenon a group of the plurality of contact points of the electricalinterconnect.
 5. The method of claim 1, wherein the measurement of theat least one electrical property is taken on all of the contact pointsof the electrical interconnect.
 6. The method of claim 1, furthercomprising: providing an actuator configured to press on the deviceunder test in the electrical interconnect; moving the actuator in aplurality of increments thereby pressing the device under test into theelectrical interconnect to a plurality of different positions; whereinthe actuator is held within a gantry; wherein the actuator facilitatesmovement in the Z axis or vertical axis to press down upon the deviceunder test; and wherein the gantry facilitates movement in the X axisand Y axis.
 7. The method of claim 1, further comprising the step ofcycling the device under test through the plurality of differentpositions multiple times to provide statistically improved results. 8.The method of claim 1, wherein pressing the device under test into theelectrical interconnect to the plurality of different positions includesmoving the device under test to a plurality of height increments orpressing the device under test with a plurality of force increments. 9.The method of claim 1, further comprising the step of providing softwareassociated with the electrical interconnect testing device and creatinga testing recipe that specifies the plurality of different positions andspecifies the plurality of contact points of the electrical interconnectthat are tested.
 10. The method of claim 1, further comprising the stepof outputting the results of the test and graphing the results.
 11. Themethod of claim 1, further comprising the step of selecting an optimumvertical height for testing based on the results of the test.
 12. Themethod of claim 1, further comprising the step of selecting an optimumforce for testing based on the results of the test.
 13. The method ofclaim 1, wherein the device under test is a shorting device or areference standard.
 14. A method, the steps comprising: providing anelectrical interconnect testing device; providing an electricalinterconnect having a plurality of contact points; attaching theelectrical interconnect to the electrical interconnect testing device;providing a semiconductor chip device having a plurality of contactpoints; aligning the plurality of contact points of the device undertest with the plurality of contact points of the electrical interconnectthe semiconductor chip device in the electrical interconnect after theelectrical interconnect has been attached to the electrical interconnecttesting device such that the plurality of contact points of thesemiconductor chip device connect with the plurality of contact pointsof the electrical interconnect; pressing the device under test into theelectrical interconnect to a plurality of different positions; andwherein the electrical interconnect testing device is capable of takinga resistance measurement on one contact point of the electricalinterconnect, or a combination of contact points of the electricalinterconnect at the plurality of different positions.
 15. The method ofclaim 14, further comprising taking a force measurement at the pluralityof different positions.
 16. The method of claim 14, wherein thesemiconductor chip device is a shorting device or a reference standard.17. The method of claim 14, wherein the at least one electrical propertyis resistance; and wherein the measurement of the at least oneelectrical property is taken on one of the plurality of contact pointsof the electrical interconnect.
 18. The method of claim 14, wherein themeasurement of the at least one electrical property is taken on a groupof the plurality of contact points of the electrical interconnect. 19.The method of claim 14, wherein the measurement of the at least oneelectrical property is taken on all of the contact points of theelectrical interconnect.
 20. The method of claim 14, further comprising:providing an actuator configured to press on the device under test inthe electrical interconnect; moving the actuator in a plurality ofincrements thereby pressing the device under test into the electricalinterconnect to a plurality of different positions; wherein the actuatoris held within a gantry; wherein the actuator facilitates movement inthe Z axis or vertical axis to press down upon the device under test;and wherein the gantry facilitates movement in the X axis and Y axis.21. The method of claim 14, wherein pressing the device under test intothe electrical interconnect to the plurality of different positionsincludes moving the device under test to a plurality of heightincrements or pressing the device under test with a plurality of forceincrements.
 22. The method of claim 14, further comprising outputtingthe results of the test and graphing the results.
 23. The method ofclaim 14, further comprising the step of selecting an optimum verticalheight for testing based on the results of the test.
 24. The method ofclaim 14, further comprising the step of selecting an optimum force fortesting based on the results of the test.
 25. An apparatus, comprising:an electrical interconnect testing device; an electrical interconnecthaving a plurality of contact points, one or more connectors, theconnectors configured to attach the electrical interconnect to theelectrical interconnect testing device; wherein the electricalinterconnect is configured to receive a device under test; wherein theelectrical interconnect includes a raised peripheral edge configured toalign the plurality of contact points of the device under test with theplurality of contact points of the electrical interconnect; an actuator;wherein the actuator is configured to press the device under test intothe electrical interconnect to a plurality of different positions; andwherein the electrical interconnect testing device is configured totaking at least one resistance measurement at the plurality of differentpositions.
 26. The apparatus of claim 25, wherein the electricalinterconnect testing device is configured to take a force measurement atthe plurality of different positions.
 27. The apparatus of claim 25,wherein the electrical interconnect testing device is configured to takea resistance measurement on one of the plurality of contact points ofthe electrical interconnect.
 28. The apparatus of claim 25, wherein theelectrical interconnect testing device is configured to take aresistance measurement on a group of the plurality of contact points ofthe electrical interconnect.
 29. The apparatus of claim 25, wherein theelectrical interconnect testing device is configured to take aresistance measurement on all of the contact points of the electricalinterconnect.
 30. The apparatus of claim 25, wherein the actuator isheld within a gantry, wherein the actuator facilitates movement in the Zaxis or vertical axis to press down upon the device under test, andwherein the gantry facilitates movement in the X axis and Y axis. 31.The apparatus of claim 25, wherein the actuator is configured to cyclethrough the plurality of different positions multiple times to providestatistically improved results.
 32. The apparatus of claim 25, whereinthe electrical interconnect testing device is configured to outputtingthe results of the test and graphing the results.
 33. The apparatus ofclaim 25, wherein the electrical interconnect testing device isconfigured to further comprising the step of selecting an optimumvertical height for testing based on the results of the test.
 34. Theapparatus of claim 25, wherein the device under test is a shortingdevice or a reference standard.